Semiconductor Wafer Cleaning Equipment Market Size 2023 to 2032

The wafer cleaning process is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate. The cleaning is done to ensure the wafer is not affected by the roughness and corrosion. The wafer cleaning process is usually done using two methods: wet wafer cleaning and dry wafer cleaning. Wet cleaning involves the use of solvent for cleaning the wafer surface and impurities are removed without creating rough surfaces afterward. Dry silicon wafer cleaning methods are less harmful to the environment as few chemicals are needed. Moreover, large wafers are better suited to the dry-cleaning process as opposed to smaller ones.

ID : IL_1054 | Language's : En/Jp/Fr/De | Publisher : IL | Format :